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02088nam a22003735i 4500 |
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20210526135748.0 |
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cr nn 008mamaa |
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100301s2010 xxu| s |||| 0|eng d |
| 020 |
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|a 9781441909848
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| 024 |
7 |
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|a 10.1007/978-1-4419-0984-8
|2 doi
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| 040 |
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|a Sistema de Bibliotecas del Tecnológico de Costa Rica
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| 245 |
1 |
0 |
|a RF and Microwave Microelectronics Packaging /
|c edited by Ken Kuang, Franklin Kim, Sean S. Cahill.
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| 250 |
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|a 1st ed. 2010.
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| 260 |
# |
# |
|a New York, NY :
|b Springer US :
|b Imprint: Springer,
|c 2010.
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| 300 |
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|a XVI, 285 p. :
|b online resource.
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| 336 |
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|a text
|b txt
|2 rdacontent
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| 337 |
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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| 505 |
0 |
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|a Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies -- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages -- Polymeric Microelectromechanical Millimeter Wave Systems -- Millimeter-Wave Chip-on-Board Integration and Packaging -- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules -- RF/Microwave Substrate Packaging Roadmap for Portable Devices -- Ceramic Systems in Package for RF and Microwave -- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications -- LTCC Substrates for RF/MW Application -- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging -- High Performance Microelectronics Packaging Heat Sink Materials -- Technology Research on AlN 3D MCM.
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| 650 |
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0 |
|a Electronics.
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| 650 |
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0 |
|a Microelectronics.
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| 650 |
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0 |
|a Microwaves.
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| 650 |
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0 |
|a Optical engineering.
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| 650 |
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0 |
|a Electronic circuits.
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| 650 |
1 |
4 |
|a Electronics and Microelectronics, Instrumentation.
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| 650 |
2 |
4 |
|a Microwaves, RF and Optical Engineering.
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| 650 |
2 |
4 |
|a Circuits and Systems.
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| 700 |
1 |
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|a Kuang, Ken.
|e editor.
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| 700 |
1 |
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|a Kim, Franklin.
|e editor.
|
| 700 |
1 |
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|a Cahill, Sean S.
|e editor.
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| 710 |
2 |
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|a SpringerLink (Online service)
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| 773 |
0 |
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|t Springer eBooks
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| 900 |
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|a Libro descargado a ALEPH en bloque (proveniente de proveedor)
|