RF and Microwave Microelectronics Packaging /

RF and Microwave Microelectronics Packaging /

Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Kuang, Ken. (Editor), Kim, Franklin. (Editor), Cahill, Sean S. (Editor)
Format: eBook
Language:English
Published: New York, NY : Springer US : Imprint: Springer, 2010.
Edition:1st ed. 2010.
Subjects:
Electronics.
Microelectronics.
Microwaves.
Optical engineering.
Electronic circuits.
Electronics and Microelectronics, Instrumentation.
Microwaves, RF and Optical Engineering.
Circuits and Systems.

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