Materials for electronic packaging /

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Materials for electronic packaging /

Detalles Bibliográficos
Autor principal:	Chung, Deborah D. L. (Editor )
Formato:	Libro
Lenguaje:	English
Publicado:	Boston : Butterworth Heinemann, c1995.
Materias:	ELECTRONICA ENCAPSULADO ELECTRONICO CERAMICA > MATERIALES

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