Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies /
| Autores principales: | , |
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| Formato: | Libro |
| Lenguaje: | English |
| Publicado: |
New York :
McGraw-Hill,
c1997.
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| Colección: | Electronic Packaging and Interconnection Series / Charles M. Harper, series advisor
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| Materias: |
| Descripción Física: | xxi, 408 páginas : ilustraciones |
|---|---|
| ISBN: | 9780070366480 |