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| LEADER |
00987nam a2200277uu 4500 |
| 001 |
000183840 |
| 005 |
20091023153339.0 |
| 008 |
090921s1997 xxu ||||| eng |
| 020 |
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|a 9780070366480
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| 035 |
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|a 9240828
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| 040 |
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|a Sistema de Bibliotecas de la Universidad de Costa Rica
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| 041 |
0 |
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|a eng
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| 082 |
0 |
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|a 621.381.046
|b L366s
|2 22
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| 100 |
1 |
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|a Lau, John H.
|e Autor/a
|4 aut
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| 245 |
1 |
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|a Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies /
|c John H. Lau, Yi-hsin Pao
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| 260 |
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|a New York :
|b McGraw-Hill,
|c c1997.
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| 300 |
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|a xxi, 408 páginas :
|b ilustraciones
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| 490 |
0 |
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|a Electronic Packaging and Interconnection Series / Charles M. Harper, series advisor
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| 650 |
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|a ENCAPSULADO MICROELECTRONICO
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| 650 |
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|a ELECTRONICA
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| 700 |
1 |
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|a Pao, Yi-Hsin
|e Autor/a
|4 aut
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| 900 |
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|a 2009
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| 912 |
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|a 23-OCT-2009 - GARRIDO CORDERO, IRINA
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| 917 |
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|a 21-SEP-2009 - BUSTAMANTE MORA, CYNTHIA
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| 949 |
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|a IG -EMQ
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| 916 |
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|a Centro Catalográfico
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