Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies /
Autores principales: | Lau, John H. (Autor, Autor/a), Pao, Yi-Hsin (Autor/a) |
---|---|
Formato: | Libro |
Lenguaje: | English |
Publicado: |
New York :
McGraw-Hill,
c1997.
|
Colección: | Electronic Packaging and Interconnection Series / Charles M. Harper, series advisor
|
Materias: |
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