Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies /
| Main Authors: | , |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
New York :
McGraw-Hill,
c1997.
|
| Series: | Electronic Packaging and Interconnection Series / Charles M. Harper, series advisor
|
| Subjects: |
Sistema de Bibliotecas de Universidad de Costa Rica
| Call Number: |
621.381.046 |
|---|---|
| Copy | Available |