Advanced flip chip packaging /

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Advanced flip chip packaging /

Bibliographic Details
Other Authors:	Tong, Ho-Ming (Editor), Lai, Yi-Shao (Editor), Wong, C.P. (Editor)
Format:	eBook
Language:	English
Published:	New York, Estados Unidos : Springer, 2013.
Edition:	1st edition
Subjects:	Aplicaciones de Flip Chip Materiales electrónicos Embalaje de chips Circuitos ópticos Diseño del sistema Diseño eléctrico Microelectrónica Libros electrónicos

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