Materials for Advanced Packaging

Materials for Advanced Packaging

Detalles Bibliográficos
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Lu, Daniel. (Editor ), Wong, C.P. (Editor )
Formato: eBook
Lenguaje:English
Publicado: New York, NY : Springer US : Imprint: Springer, 2009.
Edición:1st ed. 2009.
Materias:
Optical materials.
Electronic materials.
Metals.
Nanotechnology.
Electronics.
Microelectronics.
Optical and Electronic Materials.
Metallic Materials.
Electronics and Microelectronics, Instrumentation.
Acceso en línea:https://doi.org/10.1007/978-0-387-78219-5
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020 |a 9780387782195 
024 7 |a 10.1007/978-0-387-78219-5  |2 doi 
040 |a Sistema de Bibliotecas del Tecnológico de Costa Rica 
245 1 0 |a Materials for Advanced Packaging  |c edited by Daniel Lu, C.P. Wong. 
250 |a 1st ed. 2009. 
260 # # |a New York, NY :  |b Springer US :  |b Imprint: Springer,  |c 2009. 
300 |a XII, 724 p. 300 illus.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
505 0 |a 3D Integration Technologies - An Overview -- Advanced Bonding/Joining Techniques -- Advanced Chip-to-Substrate Connections -- Advanced Wire Bonding Technology: Materials, Methods, and Testing -- Lead-Free Soldering -- Thin Die Production -- Advanced Substrates: A Materials and Processing Perspective -- Advanced Print Circuit Board Materials -- Flip-Chip Underfill: Materials, Process and Reliability -- Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips -- Electrically Conductive Adhesives (ECAs) -- Die Attach Adhesives and Films -- Thermal Interface Materials -- Embedded Passives -- Nanomaterials and Nanopackaging -- Wafer Level Chip Scale Packaging -- Microelectromechanical Systems and Packaging -- LED and Optical Device Packaging and Materials -- Digital Health and Bio-Medical Packaging. 
650 0 |a Optical materials. 
650 0 |a Electronic materials. 
650 0 |a Metals. 
650 0 |a Nanotechnology. 
650 0 |a Electronics. 
650 0 |a Microelectronics. 
650 1 4 |a Optical and Electronic Materials. 
650 2 4 |a Metallic Materials. 
650 2 4 |a Nanotechnology. 
650 2 4 |a Electronics and Microelectronics, Instrumentation. 
700 1 |a Lu, Daniel.  |e editor. 
700 1 |a Wong, C.P.  |e editor. 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer eBooks 
856 4 0 |u https://doi.org/10.1007/978-0-387-78219-5 

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