Materials for Advanced Packaging

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Materials for Advanced Packaging

Detalles Bibliográficos
Autor Corporativo:	SpringerLink (Online service)
Otros Autores:	Lu, Daniel. (Editor ), Wong, C.P. (Editor )
Formato:	eBook
Lenguaje:	English
Publicado:	New York, NY : Springer US : Imprint: Springer, 2009.
Edición:	1st ed. 2009.
Materias:	Optical materials. Electronic materials. Metals. Nanotechnology. Electronics. Microelectronics. Optical and Electronic Materials. Metallic Materials. Electronics and Microelectronics, Instrumentation.
Acceso en línea:	https://doi.org/10.1007/978-0-387-78219-5

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