Materials for Advanced Packaging
| Corporate Author: | |
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| Other Authors: | , |
| Format: | eBook |
| Language: | English |
| Published: |
New York, NY :
Springer US : Imprint: Springer,
2009.
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| Edition: | 1st ed. 2009. |
| Subjects: | |
| Online Access: | https://doi.org/10.1007/978-0-387-78219-5 |
Table of Contents:
- 3D Integration Technologies - An Overview
- Advanced Bonding/Joining Techniques
- Advanced Chip-to-Substrate Connections
- Advanced Wire Bonding Technology: Materials, Methods, and Testing
- Lead-Free Soldering
- Thin Die Production
- Advanced Substrates: A Materials and Processing Perspective
- Advanced Print Circuit Board Materials
- Flip-Chip Underfill: Materials, Process and Reliability
- Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips
- Electrically Conductive Adhesives (ECAs)
- Die Attach Adhesives and Films
- Thermal Interface Materials
- Embedded Passives
- Nanomaterials and Nanopackaging
- Wafer Level Chip Scale Packaging
- Microelectromechanical Systems and Packaging
- LED and Optical Device Packaging and Materials
- Digital Health and Bio-Medical Packaging.