Materials for Advanced Packaging

Detalles Bibliográficos
Autor Corporativo:	SpringerLink (Online service)
Otros Autores:	Lu, Daniel. (Editor ), Wong, C.P. (Editor )
Formato:	eBook
Lenguaje:	English
Publicado:	New York, NY : Springer US : Imprint: Springer, 2009.
Edición:	1st ed. 2009.
Materias:	Optical materials. Electronic materials. Metals. Nanotechnology. Electronics. Microelectronics. Optical and Electronic Materials. Metallic Materials. Electronics and Microelectronics, Instrumentation.
Acceso en línea:	https://doi.org/10.1007/978-0-387-78219-5

Tabla de Contenidos:

3D Integration Technologies - An Overview
Advanced Bonding/Joining Techniques
Advanced Chip-to-Substrate Connections
Advanced Wire Bonding Technology: Materials, Methods, and Testing
Lead-Free Soldering
Thin Die Production
Advanced Substrates: A Materials and Processing Perspective
Advanced Print Circuit Board Materials
Flip-Chip Underfill: Materials, Process and Reliability
Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips
Electrically Conductive Adhesives (ECAs)
Die Attach Adhesives and Films
Thermal Interface Materials
Embedded Passives
Nanomaterials and Nanopackaging
Wafer Level Chip Scale Packaging
Microelectromechanical Systems and Packaging
LED and Optical Device Packaging and Materials
Digital Health and Bio-Medical Packaging.

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