Wire bonding in microelectronics : materials, processes, reliability, and yield /
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| Formato: | Libro |
| Lenguaje: | English |
| Publicado: |
New York :
McGraw-Hill,
c1997.
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| Edición: | 2. edition |
| Colección: | Electronic Packaging and Interconnection Series / Charles M. Harper, series advisor
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| Materias: |
| Descripción Física: | xiv, 290 páginas : ilustraciones |
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| ISBN: | 9780070326194 |