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01002nam a2200289uu 4500 |
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000199821 |
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20091023151815.0 |
| 008 |
090921s1997 xxu ||||| eng |
| 020 |
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|a 9780070326194
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| 035 |
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|a 9240898
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| 040 |
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|a Sistema de Bibliotecas de Universidad de Costa Rica
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| 041 |
0 |
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|a eng
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| 082 |
0 |
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|a 621.381.5
|b G287w2
|2 22
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| 100 |
1 |
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|a Harman, George G.
|e Autor/a
|4 aut
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| 245 |
1 |
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|a Wire bonding in microelectronics :
|b materials, processes, reliability, and yield /
|c George G. Harman
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| 250 |
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|a 2. edition
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| 260 |
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|a New York :
|b McGraw-Hill,
|c c1997.
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| 300 |
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|a xiv, 290 páginas :
|b ilustraciones
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| 490 |
0 |
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|a Electronic Packaging and Interconnection Series / Charles M. Harper, series advisor
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| 650 |
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|a MICROELECTRONICA
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| 650 |
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|a ENCAPSULADO ELECTRONICO
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| 650 |
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|a SEMICONDUCTORES
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| 900 |
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|a 2009
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| 912 |
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|a 23-OCT-2009 - GARRIDO CORDERO, IRINA
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| 917 |
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|a 21-SEP-2009 - BUSTAMANTE MORA, CYNTHIA
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| 949 |
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|a IG -EMQ
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| 916 |
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|a Centro Catalográfico
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