Wire bonding in microelectronics : materials, processes, reliability, and yield /
Autor principal: | Harman, George G. (Autor, Autor/a) |
---|---|
Formato: | Libro |
Lenguaje: | English |
Publicado: |
New York :
McGraw-Hill,
c1997.
|
Edición: | 2. edition |
Colección: | Electronic Packaging and Interconnection Series / Charles M. Harper, series advisor
|
Materias: |
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