Copper Interconnect Technology /

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Copper Interconnect Technology /

Bibliographic Details
Main Author:	Gupta, Tapan. (Author)
Corporate Author:	SpringerLink (Online service)
Format:	eBook
Language:	English
Published:	New York, NY : Springer New York : Imprint: Springer, 2009.
Edition:	1st ed. 2009.
Subjects:	Electronics. Microelectronics. Optical materials. Electronic materials. Electronic circuits. Nanotechnology. Electronics and Microelectronics, Instrumentation. Optical and Electronic Materials. Circuits and Systems.

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