Electromigration Modeling at Circuit Layout Level /

Detalles Bibliográficos
Autores principales: Tan, Cher Ming. (Autor), He, Feifei. (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: eBook
Lenguaje:English
Publicado: Singapore : Springer Singapore : Imprint: Springer, 2013.
Edición:1st ed. 2013.
Colección:SpringerBriefs in Reliability,
Materias:
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020 |a 9789814451215 
024 7 |a 10.1007/978-981-4451-21-5  |2 doi 
040 |a Sistema de Bibliotecas del Tecnológico de Costa Rica 
100 1 |a Tan, Cher Ming.  |e author. 
245 1 0 |a Electromigration Modeling at Circuit Layout Level /  |c by Cher Ming Tan, Feifei He. 
250 |a 1st ed. 2013. 
260 # # |a Singapore :  |b Springer Singapore :  |b Imprint: Springer,  |c 2013. 
300 |a IX, 103 p. 75 illus., 2 illus. in color. :  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
490 1 |a SpringerBriefs in Reliability, 
505 0 |a Introduction -- 3D Circuit Model Construction and Simulation -- Comparison of EM Performance in Circuit Structure and Test Structure -- Interconnect EM Reliability Modeling at Circuit Layout Level -- Conclusion. 
650 0 |a Quality control. 
650 0 |a Reliability. 
650 0 |a Industrial safety. 
650 0 |a Electronic circuits. 
650 0 |a Atoms. 
650 0 |a Physics. 
650 1 4 |a Quality Control, Reliability, Safety and Risk. 
650 2 4 |a Electronic Circuits and Devices. 
650 2 4 |a Atomic, Molecular, Optical and Plasma Physics. 
700 1 |a He, Feifei.  |e author. 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer eBooks 
900 |a Libro descargado a ALEPH en bloque (proveniente de proveedor)