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130321s2013 si | s |||| 0|eng d |
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|a 9789814451215
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024 |
7 |
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|a 10.1007/978-981-4451-21-5
|2 doi
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040 |
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|a Sistema de Bibliotecas del Tecnológico de Costa Rica
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100 |
1 |
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|a Tan, Cher Ming.
|e author.
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|a Electromigration Modeling at Circuit Layout Level /
|c by Cher Ming Tan, Feifei He.
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250 |
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|a 1st ed. 2013.
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260 |
# |
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|a Singapore :
|b Springer Singapore :
|b Imprint: Springer,
|c 2013.
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300 |
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|a IX, 103 p. 75 illus., 2 illus. in color. :
|b online resource.
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336 |
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|a text
|b txt
|2 rdacontent
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|a computer
|b c
|2 rdamedia
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|a online resource
|b cr
|2 rdacarrier
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1 |
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|a SpringerBriefs in Reliability,
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|a Introduction -- 3D Circuit Model Construction and Simulation -- Comparison of EM Performance in Circuit Structure and Test Structure -- Interconnect EM Reliability Modeling at Circuit Layout Level -- Conclusion.
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|a Quality control.
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650 |
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|a Reliability.
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|a Industrial safety.
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|a Electronic circuits.
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|a Atoms.
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|a Physics.
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4 |
|a Quality Control, Reliability, Safety and Risk.
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2 |
4 |
|a Electronic Circuits and Devices.
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650 |
2 |
4 |
|a Atomic, Molecular, Optical and Plasma Physics.
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700 |
1 |
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|a He, Feifei.
|e author.
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710 |
2 |
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|a SpringerLink (Online service)
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773 |
0 |
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|t Springer eBooks
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900 |
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|a Libro descargado a ALEPH en bloque (proveniente de proveedor)
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