Electromigration Modeling at Circuit Layout Level /

Electromigration Modeling at Circuit Layout Level /

Detalles Bibliográficos
Autores principales: Tan, Cher Ming. (Autor), He, Feifei. (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: eBook
Lenguaje:English
Publicado: Singapore : Springer Singapore : Imprint: Springer, 2013.
Edición:1st ed. 2013.
Colección:SpringerBriefs in Reliability,
Materias:
Quality control.
Reliability.
Industrial safety.
Electronic circuits.
Atoms.
Physics.
Quality Control, Reliability, Safety and Risk.
Electronic Circuits and Devices.
Atomic, Molecular, Optical and Plasma Physics.
Tabla de Contenidos:
  • Introduction
  • 3D Circuit Model Construction and Simulation
  • Comparison of EM Performance in Circuit Structure and Test Structure
  • Interconnect EM Reliability Modeling at Circuit Layout Level
  • Conclusion.

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