Electromigration Modeling at Circuit Layout Level /
| Main Authors: | , |
|---|---|
| Corporate Author: | |
| Format: | eBook |
| Language: | English |
| Published: |
Singapore :
Springer Singapore : Imprint: Springer,
2013.
|
| Edition: | 1st ed. 2013. |
| Series: | SpringerBriefs in Reliability,
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| Subjects: |
Table of Contents:
- Introduction
- 3D Circuit Model Construction and Simulation
- Comparison of EM Performance in Circuit Structure and Test Structure
- Interconnect EM Reliability Modeling at Circuit Layout Level
- Conclusion.