Wafer Level 3-D ICs Process Technology

Detalles Bibliográficos
Autor Corporativo:	SpringerLink (Online service)
Otros Autores:	Tan, Chuan Seng. (Editor ), Gutmann, Ronald J. (Editor ), Reif, L. Rafael. (Editor )
Formato:	eBook
Lenguaje:	English
Publicado:	New York, NY : Springer US : Imprint: Springer, 2008.
Edición:	1st ed. 2008.
Colección:	Integrated Circuits and Systems,
Materias:	Electronics. Microelectronics. Optical materials. Electronic materials. Materials—Surfaces. Thin films. Engineering. Electronics and Microelectronics, Instrumentation. Optical and Electronic Materials. Surfaces and Interfaces, Thin Films. Engineering, general.
Acceso en línea:	https://doi.org/10.1007/978-0-387-76534-1

Descripción
Descripción Física:	XII, 410 p. online resource.
ISBN:	9780387765341

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