Wafer Level 3-D ICs Process Technology

Wafer Level 3-D ICs Process Technology

Detalles Bibliográficos
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Tan, Chuan Seng. (Editor ), Gutmann, Ronald J. (Editor ), Reif, L. Rafael. (Editor )
Formato: eBook
Lenguaje:English
Publicado: New York, NY : Springer US : Imprint: Springer, 2008.
Edición:1st ed. 2008.
Colección:Integrated Circuits and Systems,
Materias:
Electronics.
Microelectronics.
Optical materials.
Electronic materials.
Materials—Surfaces.
Thin films.
Engineering.
Electronics and Microelectronics, Instrumentation.
Optical and Electronic Materials.
Surfaces and Interfaces, Thin Films.
Engineering, general.
Acceso en línea:https://doi.org/10.1007/978-0-387-76534-1
LEADER 02101nam a22004215i 4500
001 978-0-387-76534-1
005 20191022002732.0
007 cr nn 008mamaa
008 100301s2008 xxu| s |||| 0|eng d
020 |a 9780387765341 
024 7 |a 10.1007/978-0-387-76534-1  |2 doi 
040 |a Sistema de Bibliotecas del Tecnológico de Costa Rica 
245 1 0 |a Wafer Level 3-D ICs Process Technology  |c edited by Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif. 
250 |a 1st ed. 2008. 
260 # # |a New York, NY :  |b Springer US :  |b Imprint: Springer,  |c 2008. 
300 |a XII, 410 p.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
490 1 |a Integrated Circuits and Systems, 
505 0 |a Overview of Wafer-Level 3D ICs -- Monolithic 3D Integrated Circuits -- Stacked CMOS Technologies -- Wafer-Bonding Technologies and Strategies for 3D ICs -- Through-Silicon Via Fabrication, Backgrind, and Handle Wafer Technologies -- Cu Wafer Bonding for 3D IC Applications -- Cu/Sn Solid#x2013;Liquid Interdiffusion Bonding -- An SOI-Based 3D Circuit Integration Technology -- 3D Fabrication Options for High-Performance CMOS Technology -- 3D Integration Based upon Dielectric Adhesive Bonding -- Direct Hybrid Bonding -- 3D Memory -- Circuit Architectures for 3D Integration -- Thermal Challenges of 3D ICs -- Status and Outlook. 
650 0 |a Electronics. 
650 0 |a Microelectronics. 
650 0 |a Optical materials. 
650 0 |a Electronic materials. 
650 0 |a Materials—Surfaces. 
650 0 |a Thin films. 
650 0 |a Engineering. 
650 1 4 |a Electronics and Microelectronics, Instrumentation. 
650 2 4 |a Optical and Electronic Materials. 
650 2 4 |a Surfaces and Interfaces, Thin Films. 
650 2 4 |a Engineering, general. 
700 1 |a Tan, Chuan Seng.  |e editor. 
700 1 |a Gutmann, Ronald J.  |e editor. 
700 1 |a Reif, L. Rafael.  |e editor. 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer eBooks 
856 4 0 |u https://doi.org/10.1007/978-0-387-76534-1 

Ejemplares similares