Wafer Level 3-D ICs Process Technology

Wafer Level 3-D ICs Process Technology

Detalles Bibliográficos
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Tan, Chuan Seng. (Editor ), Gutmann, Ronald J. (Editor ), Reif, L. Rafael. (Editor )
Formato: eBook
Lenguaje:English
Publicado: New York, NY : Springer US : Imprint: Springer, 2008.
Edición:1st ed. 2008.
Colección:Integrated Circuits and Systems,
Materias:
Electronics.
Microelectronics.
Optical materials.
Electronic materials.
Materials—Surfaces.
Thin films.
Engineering.
Electronics and Microelectronics, Instrumentation.
Optical and Electronic Materials.
Surfaces and Interfaces, Thin Films.
Engineering, general.
Acceso en línea:https://doi.org/10.1007/978-0-387-76534-1

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