Materials for Advanced Packaging

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Materials for Advanced Packaging

Bibliographic Details
Corporate Author:	SpringerLink (Online service)
Other Authors:	Lu, Daniel. (Editor), Wong, C.P. (Editor)
Format:	eBook
Language:	English
Published:	New York, NY : Springer US : Imprint: Springer, 2009.
Edition:	1st ed. 2009.
Subjects:	Optical materials. Electronic materials. Metals. Nanotechnology. Electronics. Microelectronics. Optical and Electronic Materials. Metallic Materials. Electronics and Microelectronics, Instrumentation.
Online Access:	https://doi.org/10.1007/978-0-387-78219-5

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