Chemical mechanical planarization of microelectronic materials /
Autores principales: | Steigerwald, Joseph M. (Autor, Autor/a), Murarka, Shyam P. (Autor/a), Gutmann, Ronald J. (Autor/a) |
---|---|
Formato: | Libro |
Lenguaje: | English |
Publicado: |
New York :
John Wiley,
c1997.
|
Materias: |
Ejemplares similares
-
Wire bonding in microelectronics : materials, processes, reliability, and yield /
por: Harman, George G., et al.
Publicado: (1997) -
Introduction to semiconductor device modelling /
por: Snowden, Christopher M., et al.
Publicado: (1986) -
IEEE transactions on device and materials reliability /
Publicado: (2001) -
Microelectronics technology : polymers for advanced imaging and packaging : developed from a symposium sponsored by the ACS Division of Polymeric Materials: Science and Engineering, Inc., and the Polymers for Microelectronics Division of the Society of Polymer Science, Japan, at the 209th National Meeting of the American Chemical Society, Anaheim, California, April 2-6, 1995 /
Publicado: (1995) -
Microelectronics
Publicado: (1977)