Wire bonding in microelectronics : materials, processes, reliability, and yield /
| Main Author: | |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
New York :
McGraw-Hill,
c1997.
|
| Edition: | 2. edition |
| Series: | Electronic Packaging and Interconnection Series / Charles M. Harper, series advisor
|
| Subjects: |
Sistema de Bibliotecas de Universidad de Costa Rica
| Call Number: |
621.381.5 |
|---|---|
| Copy | Available |