Designing TSVs for 3D Integrated Circuits /

Detalles Bibliográficos
Autores principales:	Khan, Nauman. (Autor), Hassoun, Soha. (Autor)
Autor Corporativo:	SpringerLink (Online service)
Formato:	eBook
Lenguaje:	English
Publicado:	New York, NY : Springer New York : Imprint: Springer, 2013.
Edición:	1st ed. 2013.
Colección:	SpringerBriefs in Electrical and Computer Engineering,
Materias:	Electronic circuits. Microprocessors. Electronics. Microelectronics. Circuits and Systems. Processor Architectures. Electronics and Microelectronics, Instrumentation.

Descripción
Descripción Física:	X, 76 p. 34 illus., 29 illus. in color. : online resource.
ISBN:	9781461455080

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