Designing TSVs for 3D Integrated Circuits /

Detalles Bibliográficos
Autores principales: Khan, Nauman. (Autor), Hassoun, Soha. (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: eBook
Lenguaje:English
Publicado: New York, NY : Springer New York : Imprint: Springer, 2013.
Edición:1st ed. 2013.
Colección:SpringerBriefs in Electrical and Computer Engineering,
Materias:
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020 |a 9781461455080 
024 7 |a 10.1007/978-1-4614-5508-0  |2 doi 
040 |a Sistema de Bibliotecas del Tecnológico de Costa Rica 
100 1 |a Khan, Nauman.  |e author. 
245 1 0 |a Designing TSVs for 3D Integrated Circuits /  |c by Nauman Khan, Soha Hassoun. 
250 |a 1st ed. 2013. 
260 # # |a New York, NY :  |b Springer New York :  |b Imprint: Springer,  |c 2013. 
300 |a X, 76 p. 34 illus., 29 illus. in color. :  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
490 1 |a SpringerBriefs in Electrical and Computer Engineering, 
505 0 |a Introduction -- Background -- Analysis and Mitigation of TSV-Induced Substrate Noise -- TSVs for Power Delivery -- Early Estimation of TSV Area for Power Delivery in 3-D ICs -- Carbon Nanotubes for Advancing TSV Technology -- Conclusions and Future Directions. 
650 0 |a Electronic circuits. 
650 0 |a Microprocessors. 
650 0 |a Electronics. 
650 0 |a Microelectronics. 
650 1 4 |a Circuits and Systems. 
650 2 4 |a Processor Architectures. 
650 2 4 |a Electronics and Microelectronics, Instrumentation. 
700 1 |a Hassoun, Soha.  |e author. 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer eBooks