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120922s2013 xxu| s |||| 0|eng d |
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|a 9781461455080
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| 024 |
7 |
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|a 10.1007/978-1-4614-5508-0
|2 doi
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| 040 |
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|a Sistema de Bibliotecas del Tecnológico de Costa Rica
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| 100 |
1 |
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|a Khan, Nauman.
|e author.
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| 245 |
1 |
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|a Designing TSVs for 3D Integrated Circuits /
|c by Nauman Khan, Soha Hassoun.
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| 250 |
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|a 1st ed. 2013.
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| 260 |
# |
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|a New York, NY :
|b Springer New York :
|b Imprint: Springer,
|c 2013.
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| 300 |
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|a X, 76 p. 34 illus., 29 illus. in color. :
|b online resource.
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| 336 |
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|a text
|b txt
|2 rdacontent
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| 337 |
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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| 490 |
1 |
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|a SpringerBriefs in Electrical and Computer Engineering,
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| 505 |
0 |
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|a Introduction -- Background -- Analysis and Mitigation of TSV-Induced Substrate Noise -- TSVs for Power Delivery -- Early Estimation of TSV Area for Power Delivery in 3-D ICs -- Carbon Nanotubes for Advancing TSV Technology -- Conclusions and Future Directions.
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| 650 |
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|a Electronic circuits.
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| 650 |
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|a Microprocessors.
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| 650 |
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|a Electronics.
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| 650 |
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|a Microelectronics.
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4 |
|a Circuits and Systems.
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| 650 |
2 |
4 |
|a Processor Architectures.
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| 650 |
2 |
4 |
|a Electronics and Microelectronics, Instrumentation.
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| 700 |
1 |
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|a Hassoun, Soha.
|e author.
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| 710 |
2 |
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|a SpringerLink (Online service)
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| 773 |
0 |
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|t Springer eBooks
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