Designing TSVs for 3D Integrated Circuits /
Autores principales: | Khan, Nauman. (Autor), Hassoun, Soha. (Autor) |
---|---|
Autor Corporativo: | SpringerLink (Online service) |
Formato: | eBook |
Lenguaje: | English |
Publicado: |
New York, NY :
Springer New York : Imprint: Springer,
2013.
|
Edición: | 1st ed. 2013. |
Colección: | SpringerBriefs in Electrical and Computer Engineering,
|
Materias: |
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