Designing TSVs for 3D Integrated Circuits /
| Main Authors: | , |
|---|---|
| Corporate Author: | |
| Format: | eBook |
| Language: | English |
| Published: |
New York, NY :
Springer New York : Imprint: Springer,
2013.
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| Edition: | 1st ed. 2013. |
| Series: | SpringerBriefs in Electrical and Computer Engineering,
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| Subjects: |
Table of Contents:
- Introduction
- Background
- Analysis and Mitigation of TSV-Induced Substrate Noise
- TSVs for Power Delivery
- Early Estimation of TSV Area for Power Delivery in 3-D ICs
- Carbon Nanotubes for Advancing TSV Technology
- Conclusions and Future Directions.