Designing TSVs for 3D Integrated Circuits /
Autores principales: | , |
---|---|
Autor Corporativo: | |
Formato: | eBook |
Lenguaje: | English |
Publicado: |
New York, NY :
Springer New York : Imprint: Springer,
2013.
|
Edición: | 1st ed. 2013. |
Colección: | SpringerBriefs in Electrical and Computer Engineering,
|
Materias: |
Tabla de Contenidos:
- Introduction
- Background
- Analysis and Mitigation of TSV-Induced Substrate Noise
- TSVs for Power Delivery
- Early Estimation of TSV Area for Power Delivery in 3-D ICs
- Carbon Nanotubes for Advancing TSV Technology
- Conclusions and Future Directions.