Designing TSVs for 3D Integrated Circuits /

Designing TSVs for 3D Integrated Circuits /

Bibliographic Details
Main Authors: Khan, Nauman. (Author), Hassoun, Soha. (Author)
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: New York, NY : Springer New York : Imprint: Springer, 2013.
Edition:1st ed. 2013.
Series:SpringerBriefs in Electrical and Computer Engineering,
Subjects:
Electronic circuits.
Microprocessors.
Electronics.
Microelectronics.
Circuits and Systems.
Processor Architectures.
Electronics and Microelectronics, Instrumentation.

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