Solder Joint Reliability Prediction for Multiple Environments
| Main Authors: | , |
|---|---|
| Corporate Author: | |
| Format: | eBook |
| Language: | English |
| Published: |
New York, NY :
Springer US : Imprint: Springer,
2009.
|
| Edition: | 1st ed. 2009. |
| Subjects: | |
| Online Access: | https://doi.org/10.1007/978-0-387-79394-8 |